Ardent Concepts is focused on helping clients improve electrical efficiencies and reduce costs for high performance connectors and test sockets. We design and build custom and off-the-shelf connectors and test sockets for customers around the world using patented RC Springprobe™ technology. Industries served include the semiconductor, medical device, military and industrial design sectors.
Multi-GHz RC Springprobe™ Technology is more robust, more scalable and less expensive than legacy solutions like barrel spring probes or conductive elastomerics. Connectors and Test Sockets with RC Springprobe™ technology offer the best possible electrical performance for an all metal-solution, making them the preferred discrete-node alternative to expensive "pogo" style pins. With pitch capability down as low as .3mm and force per node as low as 5 grams, massively parallel interfaces are possible without massive force.
Ardent Concepts, Inc. - Providing reliable connector performance from development to production.
High Volume ATE Sockets
Ardent Concepts designs and builds high multi-GHz ATE sockets for high volume manufacturing using Patented RC Springprobe™ Interconnect Technology.
All of our ATE sockets offer hundreds of thousands of reliable insertions, multi-GHz AC performance, and easy to maintain field-service ready components.
Ardent's precision engineering and quick turn (in many cases, under 3 weeks for custom sockets) capabilities help engineers reduce lead times, reduce footprints, and reduce costs. Contact Us today about your test socket requirements for BGA, CSP and QFN packages.
BGA/LGA ATE TEST SOCKETS
TECHNOLOGY FEATURE SET
A quantum leap in ATE Test Socket design - The RC Springprobe AT™ from Ardent Concepts has a shorter test height than traditional spring pins, higher AC performance and lower overall socket costs. Offered in a broad range of standard and custom designed ATE sockets for FPGAs, Processors, wireless LAN, Bluetooth Wireless, GPS and Satellite Radio IC's, RC Springprobe AT Technology is a reliable, discrete node, z-axis interconnect solution for RF testing of BGA and LGA Devices.
BGA ATE Test Socket
BGA ATE X-Section
SPECIFICATIONS
PRODUCTION PROVEN PERFORMANCEArdent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity. All-metal technology allows Ardent RC Springprobe™ products to offer unparalleled performance, speed, and consistency.
QFN ATE TEST CONTACTORS
TECHNOLOGY FEATURE SET
This revolutionary new 'wiping' action RC contact technology is a Patented Ardent Solution for ATE testing of Chipscale, QFN, MLF, MLP and other small leadless devices. RC Scrub-R technology provides:
n Exceptional Signal Integrity
n Long Life
n Lower Component Costs
n Lower Overall Costs.
5MM Pitch QFN ATE Test Socket
QFN ATE X-Section
SPECIFICATIONS
PRODUCTION PROVEN PERFORMANCE
Ardent's proprietary wire-form technology is designed for unparalleled AC performance coupled with consistent contact force throughout the life of the contact. With Ardent's all-metal technology, tight pitch area array requirements can be met without sacrificing signal integrity.
All-metal technology allows Ardent RC Springprobe™ products to offer unparalleled performance, speed, and consistency.
Patented RC Springprobe™ Interconnect Technology
TRADITIONAL SPRINGPROBE VS. RC SPRINGPROBE™
SMALLER....FASTER....CHEAPER....REDEFINED
RC Springprobe™ from Ardent Concepts is a simple, more elegant means of achieving high performance electrical interconnect for chip to board, board to board and flex to board applications.
The scalable architecture of RC Springprobe™ is available in standard designs down to .4m array pitch, and we offer custom configurations with NO TOOLING and rapid prototyping for: | Exploded Contact Set View | Cross Section Contact Set View |
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