DJ DevCorp was founded in 2009 to develop new and innovative electronic photoresist material technology for license or sale and to provide product development, process development services and market development activities for the products it develops.
Technologies and products developed by DJ DevCorp are targeted to meet the needs of advanced MEMS manufacturing and wafer level packaging.
DJ DevCorp currently developing Thick Dry Film Sheets (TDFS), which are laminates pre-cut to wafer or substrate dimensions. DJ DevCorp's first offering is the SUEX line of epoxy photoresist sheets, which are offered in a thickness range of 100 microns to more than 1mm. The sheets are readily laminated to substrate surfaces and are ready to use in minutes.
NEW and NOW AVAILABLE
Advanced MEMS manufacturing and wafer level packaging
DJ DevCorp is unique in offering virtually waste-free thick dry film sheets. DJ DevCorp is the world leaders in High Aspect Ratio thick epoxy photoresist technology.
A. MEMS cell/cavity with 100 micron walls
B. Spring Feature with 20 micron coil width
Courtesy: Micro Resist Technology GmbH
C. D. Thick SUEX Features
Courtesy: Helmholtz-Berlin AZM/BESSY
Wafer Level Packaging
SUEX via fill and etch process
E. Via fill and lithography
F. Exposure: SUSS MA200 broadband
Substrate: 200mm SiOx wafer
Courtesy: JJC Development Corp.
Mechanical, Electrical, and Environmental performance specs (after cure at 200C, 30 min)
Composition and Lamination Equipment