Angstrom Sciences, Inc. was founded in 1988 by its president, Mark Bernick, to supply advanced magnetrons and refined materials for the plasma vapor deposition of high quality thin films.

Product Index:

• Sputtering targets and materials
• Cylindrical magnetrons
• Circular magnetrons
• Rectangular magnetrons

Your Complete Sputtering Targets and Materials Source

Sputtering Targets and Materials

In addition to a complete line of magnetrons and custom development services, Angstrom Sciences also offers a comprehensive selection of high-purity vacuum deposition materials.

These are available in either prefabricated sputtering targets or bulk-form evaporation materials - and we manufacture wire, rods, electron-beam evaporation cones, and hearth liners, as well.

Using a variety of specialized processes (including hot pressing, vacuum sintering, hot/cold isostatic pressing, and vacuum melting), we can provide the kind of homogenous, fine-grained, high-density materials that conform to the strictest quality control. The result is technically superior materials for all your thin film applications.

Backing Plates And Bonding

To complete your sputtering requirements, Angstrom Sciences offers both backing plates and bonding services. We can manufacture a full range of sputtering target backing plates to either original equipment specifications or custom cathode dimensions.

And we can apply specialized bonding techniques (such as high-temperature metallic or conductive-epoxy) to either our own sputtering targets and backing plates or those you supply.

All materials are specially cleaned, inspected, chemically tested, and packed under inert gas for immediate use in your vacuum system upon arrival at your facility. X-ray and ultrasound verification are available upon request.

Angstrom Sciences also refines precious metals, and supplies many custom compounds and materials (such as Indium-Tin Oxide) and superconductor research materials (such as YBCO) which are not listed above. We offer purities ranging from commercial (99.5%) to ultra high (99.9999%).

Cylindrical magnetrons

Angstrom Sciences has developed a rotating cylindrical magnetron assembly that is compact, economical, and lightweight. By utilizing the patented technology already incorporated into other Onyx®-series magnetrons, Angstrom Sciences provides a 10.6° deposition profile, 85%+ target utilization, and power savings up to 20% compared to conventional cylindrical magnetrons.

The Onyx-Revolution has been customized for Flat Panel Display, Web Coating and Solar Cell applications.

Complete assemblies are available from 3”-6” (76.2 mm-152.4 mm) in diameter and up to 154” (4 m) in length.

Other features include:

• High Magnetic Field provides a low operating voltage for reduced power requirements.
• An optimized electrical transfer design to deliver high power while avoiding arcing as well as reduced brush wear and debris.
• An NW quick connect water-to-vacuum seal for Quick target changes, shorter down times and increased production.
• A universal and cost effective magnet design with customized turnarounds.

Lightweight, easily-serviced product with off-the-shelf components for low-cost, long-term investment and reliability.

Circular magnetrons

Angstrom Sciences circular magnetrons have rapidly become recognized as the new standard of the sputtering industry. Because in addition to their advanced features such as profiled magnets, turbulent water flow, and solid stainless steel construction - they offer a host of other performance efficiencies as well.

Versatile, Compact Design

Their ultra-compact design makes them ideal for virtually any new or retrofit application - including the most complex multiple-cathode deposition clusters or the smallest vacuum chambers. And they can easily be configured for either internal or external mounts.

Total Power Compatibility

Their low-impedance heads provide RF, DC, mid-frequency DC, pulsed DC, and microwave power compatibility.

Standard Fittings

Angstrom Sciences uses ISO NW standard fittings, as well as ConFlat® metal seal flanges. All utilities are maintained at atmosphere, and are accessed through standard "O"-ring compression fittings for ease of installation in any vacuum system.

Full Range Of Sizes

Angstrom Sciences circular magnetron sources are available in 1", 2", 3", 4", 5", 6", 8", 10", 12", and 16" target sizes.

Quick, Easy Target Change

Our patented threaded clamp and anode shield allow you to change targets (sizes 1" to 6") quickly and easily without specialized tools, and their built-in adjustability lets you fit targets of varying thickness without resorting to spacing devices.

Lower Pressure, Higher Power

Our Magnetrons can operate at extremely low pressure - down to the 10-4 Torr range - and our directly cooled designs can deliver power densities up to 250 watts/in2 (39 watts/cm2).

Higher Rates And Performance

That means they can coat a greater area for their cathode size than other magnetrons. So you can maximize both your coating zone and your target utilization without the kind of trade-off in rate that other magnetrons force you to make.

Greater Target Utilization

Yet these same advanced magnetrons can give you target utilization as high as 50%.

Greater Uniformity

And, thanks to our patented profiled magnets, our magnetrons also deliver much greater uniformity of deposition - routinely in the ±3-to-5% range. (One of our research customers has even documented uniformity of ± .1% with Angstrom Sciences magnetrons.)

Anode Shields

The addition of an anode shield permits operation at lower voltage and pressure, since the distance between the cathode and anode (ground plane) is shorter. It also prevents debris from falling in the space between the anode and cathode, which would cause electrical short circuits and/or arcs. The possibility of coating bolts or target clamps is minimized, if not eliminated. Due to its' location however, there is a possibility of material flaking off the anode shield and causing a short circuit and/or contaminating the target.

Total Commitment

At Angstrom Sciences, we design, engineer, and manufacture our own complete line of magnetron sputtering cathodes for thin film deposition. It's our core business, and we're totally committed to making sure it's done right, every step of the way. So, we can assure you of the quality and reliability of every product you buy from us. And we stand ready to provide you any help you may need in specification, installation, start-up, and service.

Guaranteed

All Angstrom Sciences magnetrons are guaranteed against defects in workmanship and materials for two full years.

l           Indirect Cooled

Typical Performance Parameters

Note :: Data in the above tables represent typical performance with standard magnetrons. Results may vary with process parameters such as pressure, flow rate, target cooling, type of power, power level, target material, etc. On request, Angstrom Sciences can provide special configurations to optimize performance on any of the above parameters.

* Sputter rates are a function of power level, pressure, target material, source to substrate distance, etc. See separate "Sputter Rate" table for typical performance representative of the film deposition rate at maximum power density (i.e. about 250 w/in2, with direct cooling) and a 4 in. source to substrate distance. As a general rule, the rates will decrease linearly with lower power levels, and will decrease by about 50% for every two inches of increased target to substrate distance. Reducing the target to substrate distance by two inches will increase the film deposition rate by about 70%, all other factors remaining unchanged.

Options

Ultra High Vacuum

Magnetic Materials

Mounts

Power and Cooling

Rectangular magnetrons

Expanding Horizons

As more and more industries discover the speed, controllability, and bottom-line benefits of magnetron sputtering, production professionals are reaching out for ways to apply these advantages to larger, faster manufacturing processes.

Broader Solutions

For many, particularly those who have to coat broad physical substrates or achieve extremely high throughput, rectangular magnetrons offer the perfect solution.

Growing Applications

That's why use of rectangular magnetrons is growing so rapidly in industries such as:

Shaping The Future

And that's also why Angstrom Sciences is reshaping the future of sputtering technology with a complete line of rectangular magnetrons for every application.

Patented Advantages

Just like our circular cathodes, Angstrom Sciences rectangular magnetrons incorporate our patented profiled magnets, turbulent water flow, solid stainless steel construction, and fully-encased NdFeB rare earth magnets. And, naturally, they also feature industry-standard fittings, total power-supply compatibility, and internal and external mounting options.

Proven Performance

But, most important of all, these magnetrons deliver the unparalleled performance that has made Angstrom Sciences the new standard of the industry - operating at very low pressure and exceptionally high power, and providing the perfect balance of uniformity, utilization, and rate for any application.

Going To Any Length

Angstrom Sciences rectangular cathodes are available in a full range of target widths from 1.5 to 12 inches - and in target lengths from 1 to 20 feet. And, of course, we're fully equipped to design and build custom magnetrons too, if necessary, to meet your production needs.

Specifications

Specifications are subject to change without notice. Please contact us for actual specifications regarding your application.

Linear   Maximum Sputtering Power   Direct Cooled, DC Direct Cooled, RF Indirect Cooled, DCIndirect Cooled, RFathode VoltageDischarge CurrentOperating Pressure Maximum Watts / Sq. Inch = 250 Maximum Watts / Sq. Inch = 1/3 of DC Maximum Watts / Sq. Inch = 100 Maximum Watts / Sq. Inch = 1/3 of DC 100 to 1500 volts 0.4 amps / Sq. Inch 0.5 to 50 milliTorr   Cooling Requirements   Flow Rate @ Max. PowerMax. Input TemperatureMax. Input Pressure [open drain] 1 GPM / 4KW 20° C 60 psig   Target     Form Rectangular/Planar   Diameter Standard Cross-Sections 1.5"/38.1mm 3.5"/88.9mm, 5.0"/127mm, 6.0"/152.4mm   Thickness Typical 0.250"/6mm, 0.50"/12.7mm 0.75"/19mm, 1.0"/25.4mm   Cooling Indirect / Direct     Magnetic Enhancement Permanent [NdFeB]     Weight Weight depends on dimensions   Mounting     SourceWaterPower Customer Specified   Customer Specified   Customer Specified     Maximum Temperature 100° C     Source to Substrate Distance 2" - 12"   Construction     Cathode Body OFHC Copper   Anode 304 / 316 Stainless Steel   Insulator PTFE   Dimensions [See Below]     Internal Mount External Mount   A Target Length +2.0" / 50.8mm Target Length + 3.5" / 88.9mm   B Target Width +2.0" / 50.8mm Target Width + 3.5" / 88.9mm   C 3.5" / 88.9mm Typical 3.5" / 88.9 mm Typical   D N/A   Target Width + 2.0" / 50.8mm   E N/A   Target Length + 2.0" / 50.8mm

Internal Mount

External Mount

• Typical performance. Results may vary with process parameters such as pressure, flow rate, target material, and substrate rotation, etc.
• Some custom-engineered and specialty magnetrons may not meet standard specifications.
• All Angstrom Sciences NdFeB magnets are totally encapsulated and protected from degradation by water.
• All sources available in various external configurations.
• Specifications are subject to change without notice.

Performance

Typical Performance Parameters

* Conditions :: stationary substrate, 5 mtorr pressure, 4 in. target to substrate distance, target width greater than 2 in.

Note :: Data in the above tables represent typical performance with standard magnetrons. Results may vary with process parameters such as pressure, flow rate, target cooling, type of power, power level, target material, etc. On request, Angstrom Sciences can provide special configurations to optimize performance on any of the above parameters.

* Sputter rates are a function of power level, pressure, target material, source to substrate distance, etc. See separate "Sputter Rate" table for typical performance representative of the film deposition rate at maximum power density (i.e. about 250 w/in2, with direct cooling) and a 4 in. source to substrate distance. As a general rule, the rates will decrease linearly with lower power levels, and will decrease by about 50% for every two inches of increased target to substrate distance. Reducing the target to substrate distance by two inches will increase the film deposition rate by about 70%, all other factors remaining unchanged.

Options

• UHV Designs
• Magnetic Materials
• Mounting Configurations
• Magnetics - Balanced/Unbalanced/Coupled
• Dual Assemblies
• Process Gas Distribution