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Plasma Systems

Originating from the former TePla AG Munich, the division Plasma Systems designs, develops and builds customer specific plasma equipment. The division specializes in technologies used for the surface modification of substrates through the controlled application of plasma.

 

Index

Chip Packaging

- Bond Pad Cleaning

- Plasma Cleaning prior to Flip Chip Underfill

- Plasma Cleaning and Activation prior to Encapsulation

Failure Analysis

- Decapsulation of Packaged Devices and Boards by Plasma Etching

Chip Packaging
Trenner

Bond Pad Cleaning

Chip Packaging In chip packaging, plasma cleaning is essential for improving the cleanliness of bond pads prior to wirebonding. Ball shear and stitch pull strengths are dramatically enhanced by surface plasma cleaning.


Trenner

Plasma Cleaning prior to Flip Chip Underfill

Plasma cleaning in FlipChip packaging technology has become a must for yield improvement. Advanced Flip Chip devices are gaining in market prominence, and microwave plasma processes are unrivalled at penetrating the minute gaps beneath the dies. All surfaces, regardless of the volume under the die are perfectly activated and conditioned. PVA TePla’s microwave plasma consistently performs, providing void-free FlipChip underfill, optimum adhesion and a dramatically enhanced wicking speeds. Application suitability goes well beyond die sizes of 20x20mm and 50µm bumps.

 

To Request Application Literature or Further Information, Click Here

Plasma Cleaning and Activation prior to Encapsulation

In semiconductor micro-chip packaging, microwave plasma cleaning and activation is used in applications of adhesion promotion of encapsulant mold compounds. This includes "glob top" and "lip chip underfill" processes. The highly reactive microwave plasma uses the chemical power of oxygen radicals to modify various substrate surfaces: solder mask materials, die passivation layers, bond pads as well as leadframe surfaces. Mold delamination problems are thus eliminated, and by using PVA TePla’s microwave plasma there is no risk of ESD or other potentially harmful side effects.

To Request Application Literature or Further Information, Click Here

Related Products:
PS 80 GIGA 80 Plus

Fully automatic Microwave Plasma Cleaner for individual substrates.  Applicable as INLINE SOLUTION or STAND ALONE TOOL.

80 Plus GIGA HS: Semiconductor Innovation by PVA TePla for Microchip Packaging

  • New industry standards for throughput

  • Higher yield

  • 100x300mm leadframe ready

  • Presented at SEMICON Taiwan 2012

Press released - (Kirchheim/Munich, October 19, 2012)

The business unit Plasma Systems of PVA TePla in Kirchheim/Munich unveiled the next generation strip processing plasma system (100x300mm leadframe ready - High Speed Plasma), setting new industry standards in throughput at SEMICON Taiwan 2012.

 

The 80 Plus High Speed (HS) is the only single chamber system in the world featuring patent pending innovations in strip size conversion, handling and process, allowing up to three times higher units per hour (UPH) compared to other leadframe and substrate strip processing plasma systems to date. The system is targeted at high volume chip manufacturers improving yield and reliability for applications prior wire bonding, mold and flip chip underfill.

 

The 80 Plus High Speed is available in radio frequency (RF) and microwave (MW) technology to provide the best process solution to meet customer demands. In semiconductor microchip packaging plasma -prior wirebonding- is essential for improving the cleanliness of the bond pads. Ball shear and stitch pull strengths are dramatically enhanced by plasma cleaning. Plasma cleaning and activation is used in applications of adhesion promotion of mold compounds, eliminating yield loss due to delamination. In Flip Chip packaging technology MW plasma prior underfill has become a must for yield improvement.  Advanced Flip Chip devices are gaining in market prominence, and microwave plasma processes are unrivalled at penetrating the minute gaps beneath the dies.

 

a
GIGA 690

Mircowave Plasma System for chip carrier cleaning

PS 400
PS 400

Microwave Plasma System 400 Series for chip carrier cleaning in magazines

PS 400
PS 400 IL

Microwave Plasma System 400 Series for chip carrier cleaning in magazines

PS 400 H2 PS 400 H2

Microwave Plasma System 400 Series with hydrogen generator for chip carrier cleaning in magazines.

Failure Analysis

Decapsulation of Packaged Devices and Boards by Plasma Etching

Failure Analysis DecapsulationDecapsulation of packaged devices (such as integrated circuits (IC’s) and printed circuit boards (PCB’s)) exposes the internal components of the package. Opening devices by decapsulation allows inspection of the die, interconnects and other features typically examined during failure analysis. Device failure analysis often relies on the selective etching of polymer encapsulants without compromising the integrity of the wire bonds and device layers. This is achieved by using microwave plasma to cleanly remove encapsulant material. The etching properties of the plasma are highly selective leaving interconnects and bond pads unaffected by the plasma etching process.
(Examples of decapsulated chips)
Failure Analysis Decapsulation
Related Products:
M4L IoN 10

Laboratory or pilot scale bench top microwave system ideal for resist ashing, wafer cleaning and decapsulation of electronic devices