 Photonics & Solar PV
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Wafer Fabication |
IC Assembly & Testing |
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For over 23 years, Royce Instruments, Inc. has been an innovative global leader for design and manufacturing of precision assembly tools and high accuracy, low force bond testing equipment.
Royce's products include equipment for laser diode manufacturing, wire bond and die bond testing, semiconductor die pick and place into trays, waffle pack, and GelPak.
PRODUCTS
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Bond Testers :
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Royce 650 Universal Bond Tester
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Royce 620 Multitest Bond Tester
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Royce 610 Dedicated Wire Pull Bond Tester
To download Series 600 Bond Test Instruments Datasheet 
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| Royce Instruments bond testing systems handle a variety of testing applications. Capabilities include: |
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- Wire bond pull test
- Ball bond shear test
- Solder ball shear test
- Die bond shear test
- Zone shear test
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| Royce 650 Universal Bond Tester |
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Motorized height controlled microscope that stays in focus as it moves
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305 mm x 155 mm stage for 300 mm wafers, leadframes or substrates
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Ultra Fine Pitch (UFP) capable
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Image Capture Option which is Field Upgradable!
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World Language support
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Ribbon Bond testing for standard to high-power devices
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Die shear up to 200 kgf
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Robust test modules with Range switching, on board calibration memory, and tool protection
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| Royce 620 Multitest Bond Tester |
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Responsive joystick and manipulator: The operator controls the Royce 620 using a joystick and manipulator.
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The joystick allows the operator to control the Z height positioning of the module (and tool rotation for wire pull testing), while the manual manipulator allows the operator to control the XY and theta movements of the part.
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Compatibility with legacy systems: The Royce 620 is fully compatible with the Royce 550 and Royce 552 manipulators, test piece holders, and tools.
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| The Royce 620 Multitest Bond Tester offers an attractive bond test solution that is midway between the Royce 650 and the Royce 610. It performs all of the most frequently used applications, and it employs manual sample positioning, which in some applications allows for higher productivity over a motorized XY stage. |
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| Royce 610 Dedicated Wire Pull Bond Tester |
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Data output to any PC using RS232
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rgonomic design to support operator comfort over long shifts.
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Simple calibration interface to allow user to quickly and easily check and recalibrate the instrument with on-screen instructions (NIST traceable calibration weights available)
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Optional strip printer
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Optional keypad for enhanced failure code input
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Optional external Royce PC with Bond Test Manager soft- ware for data storage and networking
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The controls of the 610 are simple and ergonomic. Using the extremely flexible Leica S6 microscope, the 610 easily adjusts to accommodate a broad spectrum of users.
The familiar controls make training quick and easy, minimizing downtime. The standard computer mouse controls the hook height and rotation, along with triggering the test.
A numeric keypad allows the operator to enter failure codes, and the test results are visible on the LCD panel built into the mainframe. Able to perform both destructive and non-destructive tests, the 610 collects force data against the wire every 10 microseconds.
When performing destructive bond testing the maximum load is monitored and the test stops automatically when the load force falls from its maximum.
Non-destructive testing is controlled so that the rate of load application exactly meets the user's programmed limit.
Load variance also is programmable by the user prior to testing to provide stricter controls. |
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Die Sorters
Royce Instruments Die Sorters range from semi-auto table top systems to automatic high speed 300mm systems with wafer map and ink-dot die selection. Wafer map capabilities include multi-project wafers (pizza maps) and a range of industry standard wafer formats.
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AutoPlacer MP300
Automatic Die Handling & Sorting System |
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Highly Flexible, Low Cost Fully automated pick and place.
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Designed for automatic die sorting from wafer maps, includingMulti Project wafers (pizza masks)
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Easy to set up with DieSort Manager software and expanded wafer map library
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Fast change to new die size and output medium with pre-leveled output fixtures
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Flexible platform handling 3 inch to 300mm wafers on many hoop and frame types
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Picks at programmable heights, speeds and with NSC edge grippers or vacuum pick-up
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| The award winning Autoplacer MP300 die sorter is specifically engineered for automatic die sort using ink dots and wafer maps, with rich support for die binning and sorting multi-project wafers (sometimes called "Pizza" wafers) with output to Waffle packs, Gel-Pak™, film frames, JEDEC trays and substrates.
The MP300 system is very flexible and easy to set up. Ideal for high mix, medium volume production or prototyping, wafer sizes from 3 inch (150mm) to 12 inch (300mm) and film frames and rings of any type are easily accommodated. Designed for quick change over of new die sizes with drop in output tooling. Our flexible wafer mapping approach and rich die binning options enables rapid accommodation of both current and legacy wafer map formats.
The Autoplacer MP300 pick and place system has superior ability to automatically sort die from tape without damage. The micron resolution die eject mechanism and optimized die eject head design allows for complete control of die plunge up parameters allowing die as thin as 50 microns to be picked without damage. Examples of fragile die include Gallium Arsenide (GaAs) and other III-V materials.
Some applications involve die surfaces which cannot be touched by conventional surface vacuum pick up tips. Our unique optional Non Surface Contact (NSC) technology readily solves this problem. Examples include GaAs die with air bridges, biochips and ink jet heads.
Die inversion (die flipping) is also an option, making inline inversion of bumped die into output trays a simple process.
Royce die sorters have uniquely solved many die handling problems in Laser Diodes, MEMS, Microfluidics, Ink Jet head, Lab on Chip (LOC) and BioChip manufacturing. Let our experienced applications engineers help you configure the Autoplacer MP300 to meet your needs.
For more information and applications specific details, please contact our sales department.
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DE35-ST
Semi-Automatic Die Handling System
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Available for 150 and 200mm diameter wafers.
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Picks die as small as 6mil square.
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700 to 1200 UPH throughput. Application dependent.
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Quick change multi-needle eject heads.
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Programmable output stage for waffle pack and Gelpaks. Alternative output formats also available.
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Pick and place program storage.
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Optional non-surface contact capability.
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The DE35-ST Semi-automatic die pick and place system is an elegantly simple, low cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die can be placed into waffle packs, Gel-PaksTM, film frame or directly on substrates.
The DE35-ST eliminates the inefficiencies and down time usually found in small lot production. Simple to learn and use, the DE35i requires no hand tools for die size changeover and setup. Setup and option information is preserved in non-volatile memory so that, following a weekend shutdown for example, you can restart the machine without further setup.
Waffle pack pockets for die placement are automatically selected. Manual selection using the keyboard arrow keys enables completion of partially filled waffle packs. If a grading output mode is selected, the machine places the die in the next pocket of the corresponding waffle pack and advises the operator when any of the waffle packs are full.
Non-Surface Contact (NSC) Option
Picks die without touching the top surface, ideal for handling die with touch sensitive coatings. Excellent for gripping force under 10g. Picks dies from 0.06 inch square to over 1.0 inch square. Die are gripped by Vespel conductive plastic finger tips. For small die sizes, micro-machined collets are available to suit individual applications.
For more information and applications specific details, please contact our sales department.
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