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IC ASSEMBLY & TESTING PRODUCT LIST

	Failure Analysis / QA
		- Sectioning, Grinding, Polishing and Mounting Systems
		- Wafer Inspection Systems
		- Reel-to-Reel High Speed X-ray Inspection Systems with XRF
		- Carbon / Gold Coaters form SEMs
		- Probe Stations
		- Decapsulation Systems
		- Plasma Etchers, Reactive Ion Etchers
		- Universal Mechanical Testers
		- Hi-speed Acoustic Microscopes
		- X-ray Inspection Systems & CT Systems
	IC Testing
		- Test Sockets
		- Mixed Signal IC Testers
		- Hard Dockings, Manipulators and Interfaces
		- Tests & Burn-in Socket Restoration Systems
		- Turret-based Test Handlers
	Metrology
		- Automated Flatness Inspection Systems
		- Atomic Force Microscopes (AFMs), Optical Profilers, Stylus Profilers & Confocal Microscopes
		- 4-point Probe Systems
		- Wafer Inspection Systems
		- Optical Non-contact Thin Film Properties Measurement (Application for Thin Film Stress, Adhesion, Thickness & Dark Current Measurements) - Wafer Thickness Measurement Equipment
		- Wafer Measurement Systems (Thickness & Surface  Topography)
		- Stero Inspection & Measurement Microscopes
	Reliability Tests
		- High-Power Burn-In Systems
		- Thermal Shock Fluid - Leakage Test Fluid
		- Centrifuge Systems - Leakage Detection Systems - Burn-in Board (BIB) Loaders & Unloaders
	Wafer Bonder
		- Wafer Bonding Systems
	Substrates Surface Preparation
		- UVO Cleaners
		- Microwave & RF Plasma Systems
	Copper Wire
		- Copper Wire
	Mold Cleaning Solvent
	RBS-88	- Mold Cleaning Solvent

If you have any inquiries about any of the products listed above, please do not hesitate to contact our staff, who will be more than willing to help you in any way they can, at our regional offices. For contact details please visit the Contact us page.