NIL Technology is a nanotechnology company located in Kongens Lyngby, Denmark. NIL Technology is engaged in the fabrication of stamps for nanoimprint lithography (NIL), performing nanoimprint services, nanoimprint pre- and post processing and nanoimprint consultancy. NIL Technology's stamps are based on patent pending MEMS technology which generically ensures large are homogeneous imprints.. Product Index: NIL Stamps NIL Technology’s stamps are engineered to order. We strive to deliver the highest quality NIL stamps available on the market. We provide stamps for both thermal and UV-NIL with feature sizes below 20 nm. We fabricate stamps for all tool formats. NIL Technology offers: - Minimum stamp structure sizes below 20 nm
- Structures having a pitch from 40 nm and above (structure size dependent)
- Stamp structure height is patter dependent (typical aspect ratio 2:1 or better)
- Stamp sizes up to 150 mm diameter
- Both positive and negative profile stamps
- Stamp materials: Silicon, Quartz, Nickel, etc.
NIL Technology's unique fabrication facility allows us to fabricate NIL stamps from all cleanroom compatible materials. Typically, stamps are made from Silicon, Quartz or Nickel, but we have the possibility to fabricate the stamps according to your specifications. Among others we can offer: - Wafers, photomask blanks, etc.
- Silicon dioxides
- Silicon nitrides
- Metals (e.g. Au, Ti, Al, Cr, Ag, Ni, Pt)
- SU-8 or other cross-linked polymers
Standard Stamps NILT Standard Stamps are stamps with fixed patterns defined by NILT. These stamps are ideal for testing and process optimization. Grating Stamp The Grating Standard Stamp is a low-cost standard stamp with periodic grating patterns. The Grating Standard Stamp can be shipped within two business days and customers can choose among different variants with different specifications. Low-cost line gratings in silicon Different options for periods, line widths, and depth Suitable for testing and R&D within many areas Periods down to 200 nm Shipment within 2 days
In-stock stamps - Ready for shipment
| Stamp No. | Size | Active area | Period | Line width | LER | Depth | | GS1-5 | 2 inch round | 2 cm x 2 cm | 405 nm | 180 nm | 15 nm | 80 nm | | GS3-1 | 2 cm x 2 cm | 1.7 cm x 1.7 cm | 400 nm | 125 nm | 15 nm | 350 nm | | GS4-1 | 2 cm x 2 cm | 1.7 cm x 1.7 cm | 200 nm | 90 nm | 10 nm | 100 nm | | GS4-2 | 2 cm x 2 cm | 1.7 cm x 1.7 cm | 250 nm | 145 nm | 5 nm | 100 nm | | GS4-3 | 2 cm x 2 cm | 1.7 cm x 1.7 cm | 300 nm | 170 nm | 10 nm | 100 nm | | GS4-4 | 2 cm x 2 cm | 1.7 cm x 1.7 cm | 350 nm | 215 nm | 10 nm | 100 nm | | GS4-5 | 2 cm x 2 cm | 1.7 cm x 1.7 cm | 400 nm | 270 nm | 15 nm | 100 nm | | Anti-sticking layer (ASL) is optional |
Multi-Pattern Standard Stamp The Multi-Pattern Standard Stamp is optimal for testing of the nanoimprint process and test of of NIL equipment. This standard stamp comes with line widths down to 50 nm. It has 8 areas with 5 different patterns, each with different line widths and periods. The stamp is offered in both Silicon and Quartz.  Specifications | Stamp size | 2 inch round wafer | | Stamp material | Quartz (Fused Silica) or Silicon | | Stamp thickness | 500 µm +/- 25 µm | | Structure size | 50 nm - 300 nm | | Protrusion height | 100 nm | | Tolerance, lateral and vertical dimensions | +/- 15 % | | Defect density | Less than 0.1% of total patterned area |
Anti-sticking layer (ASL) and dicing are optional
Antireflective Stamp The Anti-Reflective Standard Stamp is a large area and cost-effective functional standard stamp in Nickel with a graded index profile and with a continuously changing effective refractive index.  Cost-effective and large area nickel standard stamp Anti-reflective surface structures Stamp size up to 300 mm x 300 mm Reduction of reflectivity to below 1% Two different types – Standard or High Performance Fast delivery time of typically 3 weeks
Specifications | | Type A | Type B | Type C | | Optical function | AR standard | AR High Performance* | AR standard | | Grating type | Hexagonal Array | Hexagonal Array | Hexagonal Array | | Pitch | 250 nm | 300 nm | 250 nm | | Average height | 250 nm | 300 nm | 250 nm | | Stamp size | 120 mm x 120 mm | 70 mm x 70 mm | 300 mm x 300 mm | | Patterned area | 100 mm x 100 mm | 50 mm x 50 mm | 280 mm x 280 mm | | Stamp thickness | 100 µm - 500 µm | 100 µm - 500 µm | 100 µm - 500 µm | | Expected %R PMMA | Less than 0.9% | Less than 0.6% | Less than 0.9% | * Diffraction colors visible under polar angles above about 45 degrees from normal Anti-sticking coating (ASL) and dicing are optional |
! The Anti-Reflective Standard Stamps are only for test and product development purposes.A commercial use requires a royalty agreement !
Photonic Stamp The Photonic Standard Stamp is a high-quality standard stamp in Silicon with large patterned area of photonic crystal and anti-reflective structures. It has 4 areas, each 1 cm x 1 cm, with square arrays of pillars.  Cost-effective and high quality standard stamp Large patterned area with pillars of 4 different dimensions Photonic crystal structures and anti-reflective structures Structure sizes between 125 nm and 275 nm Fast delivery time of typically 3 weeks
Specifications | Stamp size | 2 inch round wafer | | Stamp material | Silicon | | Stamp thickness | 525 µm +/- 25 µm | | Structure size | 125 nm, 175 nm, 225 nm, 275 nm | | Structure pitch | 200 nm, 300 nm, 400 nm, 500 nm | | Ptrotrusion height | 100 nm - 300 nm (you decide!) | | Tolerance, lateral and vertical dimensions | +/- 15% | | Defect density | Less than 0.1% of total patterned area |
Anti-sticking layer (ASL) and dicing are optional Custom Stamps NILT® Silicon The NILT® Silicon stamps are custom engineered stamps in silicon for wafer scale imprinting or step-and-repeat imprinting, typically in a thermal imprint set-up. The NILT Custom Stamps fit into all commercially available NIL tools and they are patterned by state-of-art electron beam lithography with structures down to 20 nm (pattern dependent). NILT® Silicon stamps are engineered for the specific purpose. NILT assists the customer in all necessary aspects related to the design of NILT Custom Stamps. 
| Stamp material | Silicon | | Stamp size | 2", 3", 4" and 6" round wafer format and any rectangular shape within these boundaries | | Stamp thickness | Typically 500 µm, maximum 2 mm | | Pattern size | From 20 nm | | Aspect ratio | From 1:2 - 1:10 (pattern dependent) | | Design | Customer specified | | Anti-sticking layer (ASL) | Optional |
NILT® Quartz The NILT® Quartz stamps are custom-designed stamps in quartz for wafer scale imprinting or step-and-repeat imprinting, typically in a UV imprint set-up. The stamps fit into all commercially available NIL tools and they are patterned by state-of-art electron beam lithography with structures down to 20 nm (pattern dependent).
The NILT® Quartz stamps are engineered for the specific purpose. NILT assists the customer in all necessary aspects related to the design of NILT Custom Stamps. | Stamp material | Quartz (Fused Silica) | | Stamp size | 2", 3", 4" and 6" round wafer format and any rectangular shape within these boundaries | | Stamp thickness | Typically 500 µm, maximum 2 mm | | Pattern size | From 20 nm | | Aspect ratio | From 1:1 to 1:5 (pattern dependent) | | Design | Customer specified | | Anti-sticking layer (ASL) | Optional |
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NILT® Quartz 65 The NILT® Quartz 65 stamps are custom-designed stamps in quartz made from 6025 mask blanks (photomask blanks). The final 65 stamps are 65 mm x 65 mm x 6.35 mm with a mesa in the center that is up to 25 mm x 25 mm with a height of 15 µm. The area around the mesa can either be transparent or non-transparent, e.g. covered with chromium. The NILT Custom Stamps fit into all commercially available NIL tools requiring this specific form factor and they are patterned by state-of-art electron beam lithography with structures down to 20 nm (pattern dependent). NILT® Quartz 65 stamps are engineered for the specific purpose. NILT assists the customer in all necessary aspects related to the design of the NILT Custom Stamps. 
| Stamp material | Quartz (Fused Silica) | | Stamp size | 65 mm x 65 mm | | Stamp thickness | 6.35 mm | | Design | Customer specified | | Pattern size | From 20 nm | | Aspect ratio | From 1:1 to 1:4 (pattern dependent) | | Mesa size | Up to 25 mm x 25 mm, typically 10 mm x 10 mm | | Mesa height | 15 µm | | Mesa surrounding | Transparrent or non-transparrent (chromium coated) | | Anti-sticking layer (ASL) | Optional |
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NILT® Nickel The NILT® Nickel stamps are custom-designed stamps in nickel for wafer and larger scale imprinting, typically in a thermal imprinting or hot-embossing set-up. The stamps fits into all commercially available NIL tools and can be supplied with structures down to 150 nm attern dependent). For hot-embossing NILT Nickel stamps can also be supplied with high precision µm sized features for hot-embossing.NILT® Nickel stamps are engineered for the specific purpose. NILT assists the customer in all necessary aspects related to the design of NILT Custom Stamps. 
| Stamp material | Nickel | | Stamp size | 2", 3", 4" and 6" round wafer format and any shape within these boundaries. On request larger stamps can be supplied. | | Stamp thickness | Typically 300 µm to 1 mm, maximum 2 mm | | Pattern size | From 20 nm | | Aspect ratio | From 1:1 to 1:4 (pattern dependent) | | Design | Customer specified | | Anti-sticking layer (ASL) | Optional |
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Imprint Service Nanoimprint Lithography | Processing | E-beam Service | NILT offers nanoimprint lithography service and NILT handles imprinting of both small and large volume orders. In order to get satisfactory imprint results then the imprint stamp patterns, the imprint polymer and the process paramteres must be designed and optimized for the specific imprint requirements. NILT’s engineers assist customers in all relevant issues to obtain full customer satisfaction: | NILT offers cleanroom processing, complementing the offered NIL and e-beam services.
Examples of processing offered are:
- Metal deposition
- Reactive-ion etching (RIE)
- Deep reactive-ion etching (DRIE)
- Lift-off
- Wafer bonding
- Wafer dicing
- UV lithography
- SEM and AFM characterization
| NILT offers high-end electron beam lithography (EBL) on customer’s substrates according to customer specifications. E-beam service is made using state-of-the-art 100 keV, Gaussian as well as shaped beam, EBL tools.
E-beam service is as a standard performed on the following substrate formats:
The EBL service is performed on state-of-the-art electron beam writers: Jeol JBX9300FS and Vistec SB352 HR. |
 Nanoimprint Equipment NIL Imprint Module Nanolithosolution (NLS) imprint module The NLS imprint module can be used as a simple add-on to existing UV-aligners allowing you to do nanoimprinting on your aligner. You can switch between normal aligner mode and nanoimprint mode simply by changing the wafer chuck on the aligner - a 2 min operation. Below, read more about the many advantages offered with the NLS imprint module. Watch the demo video-Click here. 
Turn your UV-aligner into an imprint tool - Easy to use nanoimprint lithography solution for UV aligners
- Quick and easy switching between nanoimprint and normal UV aligner function
- No extra cleanroom space needed
- Simple and robust process
- Allowing an easy and affordable way into nanoimprint lithography
Features of the NLS imprint module: - No interference with existing UV aligner processes
Patented Auto-ReleaseTM function Developed at HP Laps QuickMoldTM (polymer) available for creating working stamps Sub-10 nm feature imprinting demonstrated Imprints on 4” wafers, up to 2” imprint area in standard configuration No cleanroom footprint Overlay alignment (using UV-aligner) Compatible with several aligners. Contact the NILT team for further details
NLS imprint module and controller mounted on an UV-aligner. NLS Specification for NIL Solution Specifications | Wafer size | 4 inch | | Imprintable area | 2 inch | | Imprint pressure | 0 - 25 PSI | | Mold substrate size | 5 x 5 x 0.090 inch | | Typical imprint throughput | < 5 minutes/wafer |
Requirements | Compatibility | UV aligner | | Filtered pressure source | 70 - 100 PSI | | Vacuum source | < -14 PSI | | Power | 110-220V, 2A, 50/60Hz | | Cleanroom | Class 1000 or better | | Cleanroom equipment | - UV Aligner
- Resist spinner
- Hotplates
- Metal deposition
- Lift-off
- Dry etching- Wet bench- Fumehood- Glove box |
Physical specifications | | Controller module | Nanoimprint module | | Dimension | 5.8 x 16.5 x 12 in | 12 x 16 x 1.5 in | | Weight | 18.5 LB | 6.5 LB | | Environment | 10-35 C, 65% | |
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Photonics & Solar PV
