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Photronics/Photonics

Wafer Fabication

IC Assembly

 

Akrometrix is the leading provider of full-field modular metrology solutions for substrates and packages in the OEM, CEM, SATS and PCB segments of the global microelectronics industry. Akrometrix's TherMoiré and LineMoiré product lines offer comprehensive flatness characterization capabilities for development and production applications. A pioneer in the temperature dependent measurement arena, Akrometrix's solutions are utilized by 95% of the top 20 global semiconductor manufacturers. Founded in 1994, Akrometrix is based in Atlanta, GA USA with operations and partners located in all major and developing microelectronics manufacturing regions around the world.

 


 

Press Release:

- Advanced Second Level Assembly Analysis Techniques - Ken Chiavone's Global SMT & Packaging Article

 

- NEW!!! Press Release (Jan-20-2014) - The CXP for Cost-effective Elevated Temperature Surface CharacterizationTM

- NEW!!! Press Release (Jan-16-2014) - The Convection Reflo Emulation Module (CRE) for Next Generation Reflow

Emulation Combined with Surface CharacterizationTM

 

Product Applications:

- Introduction to High Volume Testing Protocol with Part TrackingTM / Applications

- High Volume Testing Protocol/Best Practices / Applications

- Die and Package Testing Protocol/Best Practices / Applications

- PCB Testing Protocol/Best Practices / Applications

- Socket Testing Protocol Summary / Applications

 

Product Index:

TherMoiré Platform

- TherMoiré AXP

- Model PS200S

- Model PS600S

- CoolBoost Module

- Applications

LineMoiré Platform

- Model XL

- Applications


Akrometrix Software

- Studio 4.0 Software

- Digital Image Correlation Module

- Micro Fringe Projection Module


 

 

 

 

 

 

 

TherMoiré Platform

Akrometrix' patented TherMoiré systems are the industry leading tools for advanced characterization of temperature-dependent warpage. First introduced in 1998 for use as a laboratory tool, today's generation of TherMoiré product offerings serves as the platform for an enterprise-wide warpage management solution. Innovative developments in hardware, software and data management make the TherMoiré an essential value-added component for microelectronics manufacturing around the world.

Development / Diagnostics / Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction. Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I and level II assembly yields and enhance product reliability.

TherMoiré In-Process Warpage Measurement Systems

  • Dynamic Temperature Profiling - temperature ranges from -55oC to 300oC
  • Modular Metrology - Shadow Moiré, Digital Image Correlation, Micro Fringe Projection
  • Automated Analyses - Bow, Twist, Coplanarity, Camber, CTE, Surface Tilt, etc.
  • Data Management - Centralized database tools for production monitoring, trending and customer conformity/assurance requirements.

All of the above combine to provide users with a low cost per test, a clear ROI and a platform for long-term, value-added functionality across both development and production operations.

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TherMoiré AXP

Flatness Measurement and Analysis System

The TherMoiré AXP is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré AXP captures a complete history of a sample's behavior during a user-defined thermal profile.

The combination of shadow moiré measurement and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré AXP, engineers can gain a better understanding of the interactions between materials, packages, substrates and complete assemblies.

The TherMoiré AXP is an expandable modular metrology platform:

  • Up to 400 mm x 400 mm maximum sample size
  • Acquisition of 1.4 million displacement data points in less than 2 seconds
  • Enhanced temperature uniformity convective heating and cooling
  • High resolution measurement of small form factor samples
  • XYZ axis strain and CTE calculation
  • Increased lab productivity with advanced, powered cooling
  • Support for reliability testing from -55¢XC to 150¢XC+ and reflow simulation to 280¢XC+
  • Multiple part testing for increased throughput

The TherMoiré AXP is powered by Akrometrix"s Studio 4.0 Software which includes the following modules:

  • Studio Manager
  • Profile Generator
  • Surface Measurement
  • Thermal Profiler
  • Surface Analysis
  • Report Generator
  • Micro Fringe Projection (MP10) Surface Measurement (optional)
  • Digital Image Correlation (DIC) Surface Measurement (optional)

The TherMoiré AXP can be used for a variety of laboratory applications:

  • Pb-Free processing implementation
  • Pre-production mechanical behavior qualification
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Validation of computer modeling
  • Reflow profile simulation and optimization
  • Supplier performance and conformity monitoring
  • Evaluation of component-substrate seating plane interconnect

The TherMoiré AXP can also used on the production floor:

  • Quality assurance/quality control
  • Lot-to-lot trending analysis
  • Real-time process monitoring
  • Statistical process control (SPC) analysis
  • Supplier performance and conformity monitoring

The TherMoiré AXP Optional Modules provide advanced measurement, processing and throughput capability:

  • Digital Image Correlation (DIC) Module
  • Micro Fringe Projection (MP10) Module
  • Convective Module
  • CoolBoost Module

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Model PS200S

Flatness Measurement and Analysis System
Download a PDF version of the brochure

The TherMoiré PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoiré PS200S captures a complete history of a sample's behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré PS200S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system and improving its reliability and first pass yield performance. The PS200S is critical to helping meet the ever increasing interconnect and reliability requirements on both the device and substrate levels.

The PS200S is a laboratory solution designed for use in R&D, production and failure analysis/reliability applications such as:

  • Pb-Free processing implementation
  • Pre-production mechanical behavior qualification
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Validation of computer modeling
  • Reflow profile optimization
  • Supplier performance and conformity monitoring
  • Evaluation of component-substrate seating plane interconnect

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Model PS600S

Flatness Measurement and Analysis System

Download a PDF version of the brochure

The TherMoiré PS600S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoiré PS600S captures a complete history of a sample's behavior during a user-defined thermal excursion.

The combination of the shadow moiré technique and dynamic temperature profiling is the foundation of the patented TherMoiré platform. Dynamic profiling is the most effective approach to analyze mechanical behavior induced by real-world processes and operating environments. Using the TherMoiré PS600S, engineers will gain a better understanding of the interactions of materials, packages, substrates and complete assemblies, allowing for a thorough analysis of the system, improving its reliability and operating performance. The PS600S is critical to helping meet the ever increasing interconnect and reliability requirements on both the device and substrate levels.

The PS600S is designed to meet the requirements of OEMs, PCB fabs and contract manufacturers who need large board/assembly characterization. With its 600 mm x 600 mm field of view, the PS600 is the largest temperature-dependent metrology tool available for the microelectronics industry.

The PS600S can be used in the laboratory:

  • Pb-Free processing implementation
  • Supplier performance and conformity monitoring
  • Pre-production mechanical behavior qualification
  • Evaluation of different materials and constructions
  • Failure/defect analysis
  • Failure/defect analysis
  • Validation of computer modeling
  • Reflow profile optimization
  • Evaluation of component-substrate seating plane interconnect

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Convective Module

Surface Measurement and Analysis System
The Convective Module sub-room temperature flatness measurement module is used hand-in-hand with Akrometrix' patented TherMoiré technology. The module, when coupled with the TherMoiré system, enables automated phase-stepping analysis and convective cooling and heating. For example, the Convective Module can duplicate test temperatures as required for JEDEC temperature cycling initiative JESD22-A104-B.

The Convective Module is comprised of a heating/cooling chamber assembly that fits into an existing TherMoiré oven chamber and a dual stage air cooler. The system accommodates evaluation of a viewing field as large as 200 mm x 200 mm (8 in. x 8 in.) and uses the fully integrated TherMoiré operating software. Software allows the user to input the thermal profile, temperature points for data acquisition, special purpose composition algorithms, and other information. The system uses this "recipe" to automatically collect, analyze, and store the data for further analysis.

The sample enclosure module contains sample support mounts, thermocouple connections and an insulated tube heater housed outside the sample chamber. The electronics enclosure houses the temperature controls, over-temperature safety shut-off electronics, fusing and power distribution. The standard system power requirement is 220 VAC, 50/60 Hz.

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CoolBoost Module

Flatness Measurement and Analysis System

Download a PDF version of the CoolBoost brochure

CoolBoost is an optional accessory available for the TherMoiré AXP that provides dramatic cooling rate improvement over the standard setup. While recent lead-free initiatives have driven peak reflow temperatures to 260C and above, fast post-peak cooling rates have become more critical than ever as engineers try to limit the high-temperature exposure of components as much as possible. The JEDEC Standard 22B112 (High Temperature Package Warpage Measurement Methodology) also underlines the importance of precisely replicating real-world cooling rates, specifically warning against extended profiles. The CoolBoost option allows the user to reproduce these profiles more accurately, while also lowering test times and increasing throughput.

CoolBoost is comprised of a refrigerated air source and controller; the refrigerated air is ported directly into the oven during the cooling portion of the profile, allowing for rapid cool down of the sample, as well as other sources of latent heat (oven walls, IR tubes, fixtures, etc.). CoolBoost is installed inside the TherMoiré AXP chassis in the lower storage area, so there is no increase in footprint size.

 

CoolBoost Specifications

The CoolBoost optional accessory has no effect on the field of view, resolution, repeatability, or accuracy of the TherMoiré AXP.

Dimensions: 12.1" H x 19.9" W x 19.9" D, (306mm x 506mm x 506mm)
Weight: 75 lbs (34 kg)
Cooling Capacity: 6000 BTUH @ 125F (1760 Watts @ 50C)
Power Requirement: None (draws power directly from TherMoiré AXP)
Facility Requirements: No additional connections

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TherMoiré Applications

Surface Measurement and Analysis System

 

Semiconductor Assembly and Test (SAT) Applications:

Advanced packaging designs are more than ever dependent upon mechanical integrity for effective level I and level II interconnect. Complex constructions of dissimilar materials alone account for significant losses due to die cracking, de-lamination, voiding, singulation and solder joint/bumping interconnect defects. Combine these with stacked package technologies and the impact can be exponential.

Prototype Qualification (TherMoiré) - By measuring thermo-mechanical performance at the first article stage, problems with new package designs can be identified, verified and documented before going into production, insuring customer specifications are being met. Accelerating the ramp to production can directly reduce NPI (new product introduction) costs and time-to-market for new products.

Assembly Yield and Reliability Investigation (TherMoiré) - Yield and reliability problems with a product already in production translate to increased costs as a result of waste, rework, and warranty expenses. An efficient tool for studying thermo-mechanical warpage can assist in root cause analysis and identifying the responsible party in a complex multi-organization supply chain.

Sampling Thermal Warpage for Production QC (TherMoiré) - Even after the thermo-mechanical performance of the product design is qualified, good quality practice requires ongoing monitoring. Unexpected changes in materials and processes are more often the rule than the exception. Testing equipment capable of handling large numbers of samples quickly in a repeatable automated fashion can reduce inspection time and cost. Advanced software and data management tools provided by Akrometrix enable SPC monitoring, trending and traceability.

Mechanical Model Validation (TherMoiré) - Computer simulation of thermo-mechanical performance can be a powerful tool for warpage prediction, but it requires experimental verification. Akrometrix characterization solutions provide feedback optimized for rapid comparison with simulation results and can therefore speed model development, confirmation of materials properties and overall confidence in simulation results.

 

PCB Fabrication Applications:

Key industry drivers including fine pitch interconnect devices and lead free solder temperatures are putting increased importance on substrate flatness compliance. Emerging specifications for local area (key component site) flatness at both room and elevated temperatures are today being implemented by leading OEMs to ensure higher first pass assembly yields and field reliability.

Prototype Qualification (TherMoiré) - By measuring thermo-mechanical performance at the first article stage, problems with new board designs can be identified, verified and documented before going into production, insuring customer specifications are being met. Accelerating the ramp to production can reduce NPI (new product introduction) costs and reduce time-to-market for new products.

Assembly Yield and Reliability Investigation (TherMoiré) - Yield and reliability problems with a product already in production translate to increased costs as a result of waste, rework, and warranty expenses. An efficient tool for studying thermo-mechanical warpage can assist in root cause analysis and identifying the responsible party in a complex multi-organization supply chain.

Sampling Thermal Warpage for Production QC (TherMoiré) - Even after the thermo-mechanical performance of the product design is qualified, good quality practice requires ongoing monitoring. Unexpected changes in materials and processes are more often the rule than the exception. Testing equipment capable of handling large numbers of samples quickly in a repeatable automated fashion can reduce inspection time and cost.

Mechanical Model Validation (TherMoiré) - Computer simulation of thermo-mechanical performance can be a powerful tool for warpage prediction, but it requires experimental verification. A measurement tool that provides feedback optimized for rapid comparison with simulation results speeds model development, confirmation of materials properties, and overall confidence in simulation results.

 

Electronic Assembly Applications:

'Junk in equals junk out." Substrate flatness compliance is ever more critical for successful assembly operations on both a global (whole board) and local (key component site) basis. Akrometrix' product and software offerings provide a comprehensive, quantitative means to achieve measured success on either a supplier management (sampling) or process (100%) inspection basis.

Process Development (TherMoiré) - Reflow performance of new PCBs and components can be tested without tying up the production line, reducing NPI time and cost. Thermal time-temperature profiles can be optimized in the laboratory.

Assembly Yield and Reliability Investigation (TherMoiré) - Yield and reliability problem for a product already in production translate to increased costs associated with waste, rework, and warranty expenses. An efficient tool for studying thermo-mechanical warpage assists root cause analysis and identifying the responsible party in a complex multi-organization supply chain. Localized heating effects during rework can be measured and debugged.

Traceability - (TherMoiré) - Advanced software and data management tools offered by Akrometrix enable SPC monitoring, trending and traceability. On-site or remote monitoring and reporting can provide valuable insight and time savings for customer critical response requirements.

 

OEM/ODM Applications:

95% of the world's largest semiconductor OEMs have used Akrometrix' equipment to help determine the impact that warpage has on their product offerings. Today, these OEMs are realizing a competitive advantage by introducing room temperature and temperature dependent flatness specifications to their supply base to directly improve assembly yields and product reliability.

Monitoring Vendor Quality (TherMoiré) - OEM/ODMs have to manage complex supply chains. Thermo-mechanical testing can double-check supplier performance against specifications, identify root cause and the responsible party when assembly problems arise, and predict reliability of the finished product.

Qualify New Designs (TherMoiré) - New PCB and package designs can be evaluated at the first article stage, thereby accelerating time-to-market and competitive position.

Mechanical Model Validation (TherMoiré) - Computer simulation of thermo-mechanical performance can be a powerful tool for warpage prediction, but it requires experimental verification. A measurement tool that provides feedback optimized for rapid comparison with simulation results speeds model development, confirmation of materials properties, and overall confidence in simulation results.

Electronic Materials and Passive Components Applications:

Materials and their unique properties are the building blocks of all components and substrates in the microelectronics industry. A fundamental understanding of their impact on finished product constructions is paramount to achieving effective sensitivity analyses on related processes and substitutions.

Laminates and Pre-pregs (TherMoiré) - Laminate materials suppliers need to monitor the quality of their raw materials, including resins, fibers and foils. In addition, they need to correlate raw materials properties with composite performance and monitor outgoing product quality for their customers. Thermo-mechanical testing enables verification of the as-processed properties in ways directly applicable to final use.

Sockets (TherMoiré) - Sockets designed to hold high value IC packages are complex mechanical structures. Thermomechanical testing identifies potential interconnect problems before they create yield and reliability losses.

Connectors (TherMoiré) - Connectors are frequently the longest components attached to the assembly. They have complex mechanical structure with unreinforced polymer bodies and are subject to high thermomechanical strains. Bow along the long axis and CTE mismatch problems can be identified at the first article stage, thereby increasing customer satisfaction and reducing time-to-market.

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LineMoiré Platform

The substrate (PCB/chip-carrier/silicon/etc.) is literally the foundation upon which over 90% of value-added processing is performed in the microelectronics supply chain. Substrate flatness compliance is being driven by first pass yield objectives and uncompromising product reliability. Leading OEMs and contract manufacturers are achieving these objectives by introducing local area flatness specifications to compliment traditional IPC bow and twist allowances. Together, Akrometrix and its industry partners have successfully validated the importance of substrate flatness.

Akrometrix' LineMoiré product line enables manufacturers to cost effectively measure, analyze and react to board-to-board and lot-to-lot variations in substrate flatness. Whether in a stand-alone or in a high volume application, manufacturers receive real-time data to make substrate specific decisions (pass/fail), monitor trending (SPC), identify key correlations between flatness and assembly defects and enable traceability. All of these capabilities empower engineers and managers to better understand processes and materials, improve first pass yields and provide a definitive competitive advantage in the marketplace.

LineMoiré Automated Flatness Inspection Systems:

  • Fast; less than 1.0 second data acquisition, no added cycle time to even the fastest of lines
  • Accurate; +/- 2.5 micron sensitivity or better
  • Scalable; up to 25" x 28" measurement areas
  • Flexible; stand alone or in-line
  • Small Footprint; 1m x 1m or can replace feeder conveyor at front of flow line
  • Easy to use; 15 minute operator setup; 5 minute product changeover

All of the above combined provide users with a low cost per test and a clear ROI.

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Model XL

Production Level Automated Flatness Inspection System

Download a PDF version of the brochure

The LineMoiré XL provides production level inspection for mass lamination, PCB fabrication, assembly and packaging. Shadow moiré technique is combined with phase stepping analysis to provide automated, high-sensitivity characterization of substrate topography. The LineMoire XL is the newest LineMoire model that enables single pass measurement of larger sized substrates. Both global (whole board) and local area (compoent site) analyses can be performed simultaneously. The XL was introduced in 2007 and incorporates many new features and capabilities based on customer input and technological advances:

  • Megapixel digital camera with Firewire for increased x-y resolution and reduced noise
  • Single computer design for simplicity and increased reliability
  • Usage of servo motor drive system instead of stepper motors for better reliability
  • Vibration-resistant hard drive for prevention of hard drive failure
  • Fully adjustable 3-belt conveyor to eliminate gravity induced sag

Software features include:

  • Easy to use Operator Interface
  • Entirely new "engine" taken from the highly successful and reliable LineMoiré J5000
  • Windows XP Operating System
  • Live Imagery capability eases recipe setup and camera pointing
  • New standard and customized gauges available


Creation/implementation of new gauges is dramatically simplified

The LineMoiré family of systems is a flexible tool that can be used for a variety of applications and a variety of parts in a production environment. With the ability to check a part in under three seconds, this system is designed to be operated either in-line or as a stand-alone unit. With full-field analysis capabilities, a determination on global bow and twist as well as local area warpage in key component footprint areas can be achieved in seconds. Our specialized software has the ability to condense large amounts of data into a form that allows engineers to make fast, quantitative assessments.

The LineMoiré can be used for a wide range of applications including:

  • IPC Bow and Twist inspection compliance
  • BGA substrate characterization
  • Post-process warpage inspection (pre/post cure, back-end inspection for specification requirements)
  • Assembly (incoming inspection, between multiple reflows)


The LineMoiré is:

  • Fast
  • Optical, non-contact
  • Large area (up to 600mm x 600mm), high resolution (2.5 micron)
  • Full-field: provides local and global measurements
  • Scaleable

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LineMoiré Applications

Flatness Measurement and Analysis System

Semiconductor Assembly and Test (SAT) Applications:

Advanced packaging designs are more than ever dependent upon mechanical integrity for effective level I and level II interconnect. Complex constructions of dissimilar materials alone account for significant losses due to die cracking, de-lamination, voiding, singulation and solder joint/bumping interconnect defects. Combine these with stacked package technologies and the impact can be exponential

100% Incoming Inspection of IC Substrates (LineMoiré) - Organic and ceramic substrates are critical components in BGAs and other high performance packages. A warped substrate can fracture a chip during die attach or produce a final package that fails customer specs. Shadow Moiré-based LineMoiré solutions offer the high throughput, high reliability and low cost-per-inspection necessary for 100% inspection of incoming components.

Mid-process Inspection (LineMoiré) - Carriers (e.g. Auer boats) holding multiple singulated substrates can become warped themselves; individual packages can slip "out-of-pocket". Shadow moiré inspection can identify problems before they cause yield losses, equipment jams and line stoppages.

100% Final Inspection of Packaged Components (LineMoiré) - Inspecting finished packages can screen for molding problems, blistering, delamination, die tilt, improperly sealed lids and many other production problems. Shadow moiré-based LineMoiré systems offer the high throughput, high reliability and low cost-per-inspection necessary for 100% inspection of final products.

 

PCB Fabrication Applications:

Key industry drivers including fine pitch interconnect devices and lead free solder temperatures are putting increased importance on substrate flatness compliance. Emerging specifications for local area (key component site) flatness at both room and elevated temperatures are today being implemented by leading OEMs to ensure higher first pass assembly yields and field reliability.

100% Final Inspection of PCBs (LineMoiré) - Inspecting finished boards can screen for both global (overall bow and twist requirements) and local (individual component site coplanarity) warpage. Shadow moiré-based LineMoiré systems offer the high throughput, high reliability and low cost-per-inspection necessary for PCBs up to panel size.

Mass Lamination Process Development (LineMoiré) - Flatness inspection after lamination can identify pattern transfer problems, speeding process development by investigating temperature, pressure and stack thickness effects.

Electronic Assembly Applications:

'Junk in equals junk out.' Substrate flatness compliance is ever more critical for successful assembly operations on both a global (whole board) and local (key component site) basis. Akrometrix' product and software offerings provide a comprehensive, quantitative means to achieve measured success on either a supplier management (sampling) or process (100%) inspection basis.

100% Incoming Inspection of PCBs (LineMoiré) - Inspecting incoming boards can screen for both global (overall bow and twist requirements) and local (individual component site coplanarity) warpage. Bad product can be identified and returned to the vendor before causing assembly yield problems. Shadow moiré-based LineMoiré solutions offer the high throughput, high reliability and low cost-per-inspection necessary for PCBs up to panel size.

100% Incoming Inspection of Packaged Components (LineMoiré) - Bad incoming components can be identified and returned to the vendor before causing assembly yield problems. Shadow moiré-based LineMoiré solutions offer the high throughput, high reliability and low cost-per-inspection necessary for 100% inspection of final products.

Adaptive Processing (LineMoiré) - Measurement of PCB flatness at the beginning of the line provides feed-forward information that can be used to adjust solder paste printing and component placement processes to increase yield and reduce rework.

Mid-Process Inspection (LineMoiré) - Double-sided reflow processes pose special problems when substrate flatness is adversely affected by the first reflow pass. Identifying and culling warpage failures before adding the typically higher value components on the top side can greatly reduce waste and rework costs.

Traceability - (LineMoiré) - Advanced software and data management tools offered by Akrometrix enable SPC monitoring, trending and traceability. On-site or remote monitoring and reporting can provide valuable insight and time savings for customer critical response requirements.

 

Electronic Materials and Passive Components Applications:

Materials and their unique properties are the building blocks of all components and substrates in the microelectronics industry. A fundamental understanding of their impact on finished product constructions is paramount to achieving effective sensitivity analyses on related processes and substitutions.

Heat Sinks (LineMoiré) - Heat sink flatness is critical to optimal heat transfer away from the component. 100% inspection of heat sink mating surface flatness prevents performance problems and warranty repairs due to product overheating.

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Akrometrix Software

Akrometrix Studio 4.0 Software

Overview

Akrometrix Studio is an advanced set of integrated software modules that work together to provide the most comprehensive set of surface characterization and analysis capabilities available. When used with the TherMoiré AXP surface measurement system, Studio powers a set of modular metrology solutions that generate fast, comprehensive surface information characterizing a wide range of microelectronic components and assemblies. Studio enables the user to draw conclusions and make decisions using a variety of powerful graphical and analytical analyses.

Advanced thermal profiling performance combined with state-of-the-art metrology techniques including Shadow Moiré, Micro Fringe Projection (MP10) and Digital Image Correlation (DIC), deliver the next generation in accurate, affordable, and easy-to-implement automated flatness inspection solutions.

Akrometrix Studio Surface Measurement: On-Demand Measurement capabilities

  • Run multiple phase image and 3D measurement results windows concurrently
  • View displacement graphs and data when data is acquired
  • Smooth phase images and re-render on the same screen
  • Analyze results after changing any variable
  • Compare measurements from multiple machines using built-in meta data

Enhanced set-up capabilities for thermal profiling

  • Show saturated and dark pixels for optimized image acquisition
  • Control Region of Interest (ROI) settings with precision
  • Continuously monitor sample environment with 'Live Camera'

Akrometrix Studio Surface Analysis:

Freedom to analyze and compare 2D and 3D data sets

  • Control multiple graphs on-screen at once
  • Automated output of Edge, Diagonal, 2D, and 3D Displacement plots
  • Mask areas and burn masks permanently into phase images
  • Calculate one displacement data set relative to another
  • Export data for further analysis into computational applications such as ANSYS and MATLAB


Multiple Chord Plot Analyses

  • Draw chord lines across phase images at any angle
  • Plot multiple displacement lines on a single graph
  • Create and save/load multiple chord sets

Advanced 3D Rendering

  • View up to 1.4 million displacement data points on each graph
  • 4X the detail of previous graphical renderings; previously hidden surface features are now visible
  • Zoom, rotate, crop and export 3D displacement graphs in multiple formats

Powerful Batch Processing

  • Apply masks, filters, chords, rotation and other operations to hundreds of phase data sets
  • Multiple output and export options for graphical and analytical analyses

 


Akrometrix Studio Profile Generator:

  • Create thermal profiles graphically; 'click' to add temperature points and actions
  • Assign ramp rates, soak times and cool down periods using numerical settings
  • Set machine control action points by clicking on profile segments
    • Measurement points (capturing phase images)
    • Blower on/off points
    • Exhaust on/off points
  • Export profiles as tables or graphs
  • Save/load profiles for editing and customizing


Studio Ergonomics and Ease-of-use:

  • Studio Manager taskbar organizes complex and powerful software modules
  • Operators can now move windows of information to where it is most useful
  • Multiple results can be viewed and compared side-by-side
  • Context-sensitive menus:
    • Right-click in windows for context menus
    • Configure settings with in-window selections
    • Movable acquisition and results windows

Akrometrix Studio Modularity and Expandability:

Core modules installed on each TherMoiré AXP powered by Studio Software include:

  • Studio Manager - Application that provides organization for launching and switching between all Studio modules.
  • Surface Measurement - Updated TherMoiré software application used for ROI set-up and on-demand measurements
  • Surface Analysis - Updated Fringe Analysis software application that features multiple 3D windows, relative analysis and user-defined chords
  • Report Generator - Application for creating custom-formatted reports for presenting data and results in multiple application formats

Optional Modules include:

  • DIC Surface Measurement - Optional software module utilized for capturing stereo images for processing in VIC 3D.
  • MP10 Surface Measurement - Optional software module for capturing 1.4 million data points within a 13 mm x 17 mm field of view.

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Shadow Moiré

Flatness Measurement and Analysis System

Download a PDF version of the brochure

Shadow Moiré is a non-contact, full-field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. It requires a Ronchi-ruled grating, a white line light source at approximately 45 degrees to the grating and a camera perpendicular to the grating. Its optical configuration integrated with the heating chamber is shown in the figure below. A technique, known as phase stepping, is applied to shadow moiré to increase measurement resolution and provide automatic ordering of the interference fringes. This technique is implemented by vertically translating the sample relative to the grating.

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Digital Image Correlation

Flatness Measurement and Analysis System

Download a PDF version of the brochure

Digital Image Correlation is a non-contact, full-field optical technique for measuring both in-plane and out-of-plane displacements of an object surface. A high contrast, random speckle pattern is applied to the surface of interest. Two cameras are mounted above the oven, viewing the sample from different angles.

Two simultaneous images from both cameras are digitized. Software identifies the same point on the surface from both perspectives, using pattern recognition of the speckles within a small pixel window. Using the principle of stereo triangulation, the spatial position of the pixel window relative to the cameras is determined in 3D space. Stepping the pixel window across the sample, the warpage of the surface can be mapped out in 3 axes.

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Micro Fringe Projection

Flatness Measurement and Analysis System

Download a PDF version of the brochure

Micro fringe projection is a non-contact, full-field optical technique for out-of-plane topography measurement. A glass grating and a white light source are used in the MP10 system. The normal of the grating plane has a 45-degree angle with respect to the sample. A Fringe pattern on the grating is projected onto the sample surface through a set of projection lenses. A camera above the sample acquires a series of images while phase stepping is performed by shifting the grating along its grating plane. The images are then used to calculate the relative vertical displacement at each pixel position from its reference plane.

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