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photronics
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Photronics/Photonics

Wafer Fabication

IC Assembly

ISIS sentronics GmbH was founded in 2006 by CEO Dr. Alexander Knüttel in Mannheim.  At  ISIS sentronics, an optical sensor technology is being applied based on the their exsisting know-how of medical technology.  Optical sensors and systems for industrial measurement and testing technology in a production environment constitute the target market of  ISIS sentronics. Their market segments served are: wafers/electronics, films/coatings, and automotive/machine components/microsystems engineering.

Their patented SCI technology permits extremely fast high-precision determination of layer thicknesses as well as three-dimensional form factors or microdefects. The ISIS sensor portfolio currently includes StraDex as a unique sensor for in-line monitoring of multilayer film production as well as RayDex as a unique product for dimensional metrology of very small interior spaces (diameter: 1 mm).

Stand-alone systems developed by ISIS sentronics offer all-in-one solutions meeting customers’ needs. Thus SemDex systems have numerous applications in the wafer/MEMS market and i-Dex systems in the measurement of internal geometries of precision components (markets: automotive/mechanical engineering, and medical technology).

 

PRODUCTS

ISIS sentronics offers an extensive choice of sensors for a very wide range of applications and industries. The robust construction of RayDex and StraDex sensors permits their direct use in production processes. For example, a StraDex sensor can be used to measure the thickness of individual film layers during production.

Coatings (wet or dry) can likewise be measured during the production process. The easy-to-use i-Dex and SemDex stand-alone systems are suitable for use both in production and in a measuring room environment. The objects to be measured (wafers, glass and also automotive and machine components) are placed directly in the system (may also be palleted) and a measuring program is run.

  • stand-alone systems for films / coatings
  • stand-alone systems for Mechanical Engineering / Automotive
  • stand-alone systems for Medical Technology
  • stand-alone systems for Wafers/MEMS

Stand-alone systems

i-Dex Komplettsystem

i-Dex f  i-Dex p  i-Dex r  i-Dex t

 

SemDex 301 Komplettsystem

SemDex 100 Series  SemDex 300 Series  SemDex A31  SemDex A32

SemDex F12  SemDex M21  SemDex M31  SemDex M31-a

 

 

 

i-Dex Series

Logo i-Dex

The all-in-one solution for non-contact entry into interior spaces

ISIS sentronics offers a wealth of experience in high-accuracy, non-contact 3D (interior space) metrology embodied in the world-unique RayDex and StraDex sensors. These sensors provided the basis for development of the i-Dex all-in-one solution. Four i-Dex products permit 3D measurement of both interior spaces and exteriors, as well as determination of wall thicknesses.

 

i-Dex f

i-Dex f

The i-Dex f stand-alone system permits three-dimensional measurement of rotationally symmetrical interior spaces. The freeform object is clamped in a holder and measurement is performed either with the RayDex ca sensor head with integrated axial motion or with the RayDex cr sensor head with external actuation.

The measured parameters are, for instance, diameter, roundness, ovality, conicity, and concentricity. Moreover, technical roughness values can also be determined down to a roughness of Rz = 0.5 µm. Several objects on a pallet can be precisely targeted and measured with the aid of a mechanical 200 × 200 mm 2D positioning stage. In addition, the positioning stage permits calibration of the sensor with probe by means of a calibration body located at the edge of the field of measurement.

Camera recognition of drilled holes in order to define target coordinates for insertion of the probe is available as an option.

iDex_f_eng.pdf  907.51 KB

 

i-Dex p

i-Dex pThe i-Dex p stand-alone system can be used to evaluate rotationally symmetric as well as almost planar objects (e.g. brake disks) with regard to their surface profile. The objects rotate on an air-bearing stage.

A StraDex p is generally used for detection from above. Measured parameters are, for instance, flatness and conicity. Technical roughness parameters can be determined down to a minimum roughness of Rz = 0.5 µm.

iDex_p_eng.pdf  (706.81 KB)

 

i-Dex r

i-Dex r Komplettsystem

The i-Dex r stand-alone system permits three-dimensional measurement of the interiors and exteriors of rotationally symmetrical objects. The object is clamped vertically in a holder which rotates on an air-bearing stage. Internal measurements are performed with the axially adjustable RayDex cr sensor head. The exterior is generally assessed with a StraDex p sensor. Measured parameters are, for instance, diameter, roundness, ovality, conicity, and coaxiality.

Moreover, technical roughness parameters can be determined down to a minimum roughness of Rz = 0.5 µm. Both sensor heads can be calibrated with a separate calibration body. Taking the results of boths sensors together makes it possible to measure wall thicknesses of metallic objects.

iDex_r_eng.pdf (460.25 KB)

 

i-Dex t

i-Dex t KomplettsystemThe i-Dex t stand-alone system permits three-dimensional measurement of the interiors and exteriors of almost rotationally symmetric objects such as tubes intended for medical applications.

The object is placed horizontally in a positioning device consisting of two rotating precision rollers. The internal measurements are performed with a sensor based on the RayDex cr. The exterior is usually examined with a StraDex p sensor.

The measured parameters are, for instance, diameter, roundness, wallthickness, conicity and coatingthickness. Moreover, technical roughness parameters can be determined down to a minimum roughness of Rz = 0.5 µm. The mechanical positioning device can be shifted electrically in an axial direction to permit complete three-dimensional measurement. This axial shift also permits calibration of the two sensor heads, i.e. the RayDex sensor head (for internal measurement) and the StraDex sensor head (for external measurement), with an external calibration glass.

  iDex_t_eng.pdf (713.4 KB)

 

 

 

SemDex Series

Logo SemDex

The all-in-one solution for non-contact measurement of wafers (and films)

ISIS sentronics can offer you the benefits of many years of experience in high-precision, non-contact layer thickness metrology in the form of the world-unique StraDex sensors. A series of all-in-one solutions known as SemDex was developed on the basis of these sensors.

 

The two semi-automatic SemDex-101/301 products permit measurement of layer thicknesses as well as other parameters of wafer materials.

 

The fully automatic SemDex A31 also offers automatic loading/emptying. Thin films are evaluated with the semi-automatic SemDex F12.

 

SemDex 100 Series

 

SemDex 101

 

SemDex 101The SemDex 101 system is designed for off-line applications in quality assurance. It incorporates the StraDex f2 or f24 sensor head, and a motorized x-y positioning stage for measurement of layer thickness profiles.

Flat films or wafer materials up to a maximum size of 100 × 100 mm can be measured. A prism or clamping unit also permits measurement of coatings on cylindrical objects, for example from the field of medical technology.

The StraDex p sensor head can also be used for evaluation of surface profiles.

SemDex101_eng.pdf (1.59 MB)

 

 

 

SemDex 300 Series

SemDex 301

SemDex 301 is a semi-automatic wafer inspection system: up to 300-mm wafers (also with frames) are introduced manually for fully automated measurement. Measured parameters are layer thickness, TTV, bow/warp, and flatness; TSV depths and roughness have recently also been added to the list. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.

The overall thickness of a sandwich wafer with internal metallization layer can be determined with the aid of a second StraDex f24 sensor head (from below the wafer).

A StraDex p sensor can also be used instead of the StraDex f24 for profilometry of the upper side of the wafer.

This sensor head can also serve for depth determination of TSVs. The newly developed StraDex a sensor head is used for determining roughness.

The integrated vacuum chuck has numerous drill holes to ensure that the wafer remains undistorted during detection of its underside.

SemDex301_eng.pdf  (695.25 KB)

 

SemDex A31

SemDex F31SemDex A31 is a fully automated wafer inspection system for automatic loading, measurement, and sorting of up to 300-mm wafers (with or without frames). It has up to two loading ports. Parameters such as layer thickness, TTV, bow/warp, flatness, and, as of recently, TSV depths and roughness are determined in the measuring chamber. Single or multiple layers can be measured with an integrated StraDex f24 sensor head.

In the case of a sandwich wafer with internal metallization layer the overall thickness can be determined with the aid of a second StraDex f24 sensor head (from below the wafer). A StraDex p sensor can also be used in place of the StraDex f24 for profilometry of the upper side of the wafer. This sensor head can also serve for depth determination of TSVs.

The integrated vacuum chuck is fitted with three electrically controlled lifting pins in order to raise and lower 200-mm and 300 mm wafers for loading with a gripper. It also has numerous drill holes to prevent distortion of the wafer during detection of its underside. The newly developed StraDex a sensor head is used for determining

 

 

SemDex A32

Automated Non-Contact Metrology System for 3D Advance Wafer Packaging

SemDex A32 is a fully automated wafer inspection system with 2 load-ports and high throughput (more than 60 wafer / hour) for wafer-cassettes until 300 mm max. A version with one load-port is also available.

The evaluation comprises thickness (TTV) measurements of substrats (e.g. after back grinding) and bow / warp in one scan. The integrated StraDex f24, p sensors allow thickness-measurements up to 7 µm (standard) and with the latest technology even up to 2.5 µm. In the twin sensor mode also total thicknesses can be evaluated.

With an additional StraDex a sensor roughness up to nm area can be evaluated optionally.

SemDex A32 is a fully automated wafer inspection system with 2 load-ports and high throughput (more than 60 wafer / hour) for wafer-cassettes until 300 mm max. A version with one load-port is also available.

The integrated StraDex f24, p sensors enable thickness values down to 7 µm (standard) or even 2.5 µm with the newest technology. In twin sensor mode total thickness can be evaluated as well.

SemDexA32.pdf  (1.06 MB) 

 

 

SemDex F12

F12

The SemDex F12 was designed for off-line applications in quality assurance with the goal of measuring thin films (from 5µm thickness). It incorporates the StraDex f2-80 sensor head (equipped for an optical wavelength of 830 nm), and a motorized x-y positioning stage for measurement of layer thickness profiles. Films or coated flat samples measuring up to 100 × 100 mm can be evaluated.

Surface profiles and very thin layers of 5 µm to 60 µm can be determined on use of the StraDex p-80 sensor head (optical wavelength 830 nm).

SemDexF12_eng.pdf (394.2 KB)

 

 

SemDex M21

SemDex MF 201The low-cost completely manual system permits point-by-point measurement of (substrate) layer thicknesses. Up to 8″ wafers can be measured.

SemDexM21_eng.pdf  (665.22 KB)

 

 

 

SemDex M31

SemDex MF 201The low-cost completely manual system permits point-by-point measurement of (substrate) layer thicknesses. Up to 12″ wafers can be measured.

SemDexM31_eng.pdf (665.16 KB)

 

 

SemDex M31-a

The cost-effective manual wafer inspection system SemDex M31 - a permits measurements of local 3D surface topographies, bumps, vias and electronics structures at wafers, flat panels, MEMS and other related objects. At any manually selected position,, the integrated

StraDex a sensor is able to evaluate finest 3D structures at nm accuracies over a small area within typically (0.5 mm)2. Due to the very short acquisition time of  < 1 sec. the requirements for vibration control are typically small. The automatic focusing at the object surface renders details of the sample to be uncritical. The chuck can cover wafers up to 300 mm (12”) diameter. Optionally the system can be equipped with an electrical stage.

 

Application:

•  Micro 3D surface topography
•  Bumps (height, diameter, shape)
•  Vias (with small aspect ratio), trenches, elektronic structures
•  Roughness (Ra > 1 nm)

 

Object materials:

Substrates like         • Silicon
                               • GaAs
                               • CdTe
                               • Glass
                               • Polyamide etc.

SemDexM31a_eng.pdf  (672.28 KB)

 

 

Sensor heads