Camtek designs, develops, manufactures and markets technologically advanced, cost-effective systems and related software products that are used to enhance processes and yields.
Camtek addresses the specific needs of each industry with dedicated solutions, based on a common core of intelligent imaging technologies.
Advanced packaging of semiconductor devices depends on known-good-die to ensure high production yields and reliable device performance. Defects in the active die area or on interconnect pads, as well as deviations in bump dimensions and placement, may lead to device failure.
Camtek's Falcon line of automated wafer inspection and metrology systems helps semiconductor manufacturers, bumping service providers, packaging foundries and test houses monitor their production processes and enhance yield.
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Falcon systems deliver outstanding 2D and 3D inspection capabilities in a versatile and flexible platform that meet the evolving demands of any application. Clean room compatibility and compliance with factory automation standards allow Falcons to fit seamlessly into the most advanced production environments.
|Falcon 800 series for bumped wafer metrology offers fast, precise 2D and 3D inspection of all bumps on a wafer and reports die coplanarity. Falcon 800s inspect solder and gold bumps for height, size, shape and placement deviations, as well as detect die surface defects.|
|Falcon 500 series for general wafer inspection inspects wafers before and/or after functional testing for surface, probe mark and bump defects that may impact die integrity or interconnect reliability.|
|Falcon 500PD series for post-dicing inspection of framed wafers detects 2D surface, probe mark, bump and dicing-related defects. Die alignment technology ensures reliable detection even when cut dice have shifted on the wafer.|
|Falcon 600 series for special applications handles fully automated optical wafer inspection for complex products such as MEMS and WLP. |
AOI solutions for the Semiconductor industry
Automated wafer inspection and metrology systems helps semiconductor manufacturers, bumping service providers, packaging foundries and test houses monitor their production processes and enhance yield.
Camtek offers a wide range of AOI solutions for the Semiconductor industry for both the Front End and Back End manufacturing process. Integrated 3D and 2D inspection and metrology capabilities make Camtek's systems the tool of choice for wafer inspection in the leading FABs, bumping houses, test and assembly facilities worldwide.
| ||Camtek's SELA division is a leader in SEM, TEM ad STEM sample preparation. Prior to our innovative technology, conventional |
(manual) sample preparation was imprecise, involved many time consuming steps, and high maintenance. With our automated SELA sample preparation tools, you can benefit from a significant reduction in sample preparation processing time from hours to less than ten minutes. This aspect alone equates to a lower cost of ownership. Your outcome is a pristine surface not effected by the artifacts remnant of a typical of polishing process.