logo
 
Search   简体中文 | 繁體中文 | English   |    TELTEC Taiwan 
teltec logo teltec home teltec about us teltec products teltec news teltec career teltec contact us teltec sitemap
photronics
teltec

Photronics/Photonics

Wafer Fabication

IC Assembly

Denton Vacuum, LLC

Since 1964 Denton Vacuum, LLC has designed and manufactured cutting edge thin film deposition systems for R&D and manufacturing.  Proprietary systems, developed to customer specifications, and standard thin film systems are available.  Several standard turnkey batch systems are available to fit any budget from research and development to manufacturing. We also offer fully automated modular in-line systems tailored to meet the specific needs of high volume manufacturing processes. Modularity allows for low cost upgrades in technology and enables rapid ramp up as volume increases. Our deposition technologies include PVD, PECVD, Magnetron Sputtering, Electron Beam Deposition, Ion Beam Enhanced Deposition, Ion Assisted Deposition, Plasma Sterilization, Reactive / Thermal Deposition, Sputtering and Reactive Ion Etching.

Our typical markets include Precision Optics, Opthalmics / Sunwear, Electronics, Electro-Optics, Telecommunications, Semiconductor Metallization, Thin Film R&D, Microscopy, Sample Preparation and Thermal Imaging.

System Type and System Series:

PECVD

Explorer
Voyager
Helios
Phoenix

PVD

BTT IV
DV-502B
Discovery HDG 
Explorer 
Integrity
Phoenix 

Ion Beam Etching

Discovery HDG

Sputtering

Desk
Desktop Pro
BTT IV 
Explorer
Voyager
Discovery
Phoenix 

 

PECVD SYSTEMS

Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas or liquid precursor to produce a specific thin film on a substrate. Precipitation of material is initiated by the creation of plasma and is generally RF frequency or DC discharge by electrodes. This electrically active coating area is filled with the reacting precursor. Applications for these processes include three dimensional or conformal coatings.

    Explorer Series

 Explorer Series Thin Film Sputtering System
  • Configurable for Sputtering, PVD, or PECVD applications
  • For use in R&D and batch production environments
  • Accepts up to 10" substrates
  • Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
  • Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

Download Brochure

 
 Voyager Series   
 Voyager series configurable for Sputtering or PEVCD coating
  • Configurable for Sputtering or PECVD applications
  • For use in R&D and batch production environments
  • Accepts up to 10" substrates
  • Vacuum chamber sizes up to 24"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                   

Download Brochure

 
     
 
 Helios Series   
 Helios PECVD Thin Film Coating System
  • Batch production system for PECVD applications
  • Accepts up to 39" substrates
  • Chamber sizes up to 44"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                     

Download Brochure

 
     
 
 Phoenix Series   
 Phoenix inline production system configurable for sputtering, PVD, PECVD applications
  • Inline production system configurable for Sputtering, PVD, or PECVD applications
  • Accepts up to 31" x 61" substrates
  • Chamber sizes up to 80"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                     

Download Brochure

Return to System Type and System Series.

PVD SYSTEMS

Physical Vapor Deposition (PVD) is a coating method that involves purely physical processes such as high temperature vacuum evaporation by electron beam , resistive or ion beam sputter bombardment rather than involving a chemical reaction.

 
 BTT IV   
 Bench Top Turbo IV Evaporation System
  • Configurable for Sputtering or PVD applications
  • For use in R&D and sample preparation environments
  • Accepts up to 6" substrates
  • Bell jar size up to 12" dia. x 18" high
  • Automated touch screen controls

Download Brochure

 
     
 
 DV-502B   
 DV-502B Coating System
  • Rapidly cycles between atmosphere and high vacuum
  • For use in R&D and sample preparation environments
  • Accepts up to 6" substrates
  • Bell jar size up to 12" dia. x 18" high
  • Automated touch screen controls

Download Brochure

 
     
 
 Discovery HDG   
 Discovery HDG
  • Ion Beam Etching & Reactive Ion Beam Etching
  • Ion Beam Deposition & Ion Beam Assisted Deposition
  • Accepts up to 8" substrates
  • Vacuum chamber size 26" dia. x 30" wide
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                   

Download Brochure

 
     
 
 Explorer Series   
 Explorer Series Thin Film Sputtering System
  • Configurable for Sputtering, PVD, or PECVD applications
  • For use in R&D and batch production environments
  • Accepts up to 10" substrates
  • Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
  • Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                  

Download Brochure

 
     
 
 Integrity Series   
 Integrity batch production system for PVD applications
  • Batch production system for PVD applications
  • Accepts up to 31" x 61" substrates
  • Chamber sizes up to 80"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

Download Brochure

 
     
 
 Phoenix Series   
 Phoenix inline production system configurable for sputtering, PVD, PECVD applications
  • Inline production system configurable for Sputtering, PVD, or PECVD applications
  • Accepts up to 31" x 61" substrates
  • Chamber sizes up to 80"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software

Download Brochure

 

 

    

Return to System Type and System Series.

 

 Ion Beam Etching

 

 
Discovery® HDG
 
 

 

The Discovery® HDG
Ion Beam Deposition and Etch Platform
The Discovery HDG provides a turnkey system for a range of processes: Ion Beam Deposition, Ion Beam Assisted Deposition, Ion Beam Etch, Reactive Ion Etch.

Features

  • Cool Substrate During Process
  • Tilting to Off Axis Angles
  • Rotation to 20 RPM

 

Discovery® HDG Brochure (Requires PDF reader)

Get Adobe Reader

Discovery HDG Ion Beam Deposition System
 

Powerful Control System available in semi-manual mode or in fully automatic mode with one push automation to reduce system downtime.

Process Pro Upgrade Offers:

  • Consistent controls across all Denton Vacuum Products
  • Standard software makes it easy to support and avoid costly customization fees
  • Source code for your programs so you can customize your programs.
  • Network capabilities makes the discovery a node on your network enabling real-time, remote support and upgrades.

Convenient Access to Subsystems
Rear or bottom mounted pumps provide easy access for service based on your workspace needs

Multiple Pumping Configurations
A variety of cryogenic, mechanical and turbo pump configurations are available to fit your budget and process.

 

Typical Appications

  • Nanotechnology
  • Electronics
  • Semiconductor (Compound or Other)
  • Materials Research
  • Research & Development
  • Medical Devices
  • Precision Milling
  • Via Etching

 

Powered by Veeco

 
Options
Evaporation

HDG Tilt Fixture, Single Rotation, 6” or 8” Diameter

check

HDG Tilt Fixture, Planetary Rotation, Three 6” Water Cooled Planets

check

RF or DC Ion Beam Deposition Sources

check

RF or DC Ion Beam Etch and Assist Sources

check

Optical Spectroscopy and Point Detection

check
Pump Options 
Turbo
check
Oil free mechanical
check
 
   

Return to System Type and System Series. 

 

SPUTTERING SYSTEMS

Sputtering deposition is a method of depositing thin films by using ions for ejecting material from a target which deposits a thin film onto a substrate commonly using RF, DC or Pulsed DC power sources. Applications for sputtering include scalpels, bone saws, reamers, or any flat substrate.

 
 Desk Series   
 Desk V Microscopy Sample Preparation Sputtering Tool
  • Compact benchtop design
  • For use in R&D and SEM applications
  • Accepts up to 4" substrates
  • Vacuum chamber 6" Pyrex or Steel (TSC model)
  • Automated touch screen controls

Download Brochure

 
     
 
 Desktop Pro   
 Desktop Pro Sputtering System
  • High performance Sputtering in a desktop design
  • Configurable with up to two 2" magnatrons
  • Accepts up to 6" substrates
  • Vacuum chamber size 10" dia. x 10" high
  • Automated touch screen controls

Download Brochure

 
     
 
 BTT IV   
 Bench Top Turbo IV Evaporation System
  • Configurable for Sputtering or PVD applications
  • For use in R&D and sample preparation environments
  • Accepts up to 6" substrates
  • Bell jar size up to 12" dia. x 18" high
  • Automated touch screen controls

Download Brochure

 
     
 
 Explorer Series   
 Explorer Series Thin Film Sputtering System
  • Configurable for Sputtering, PVD, or PECVD applications
  • For use in R&D and batch production environments
  • Accepts up to 10" substrates
  • Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
  • Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                  

Download Brochure

 
     
 
 Voyager Series   
 Voyager series configurable for Sputtering or PEVCD coating
  • Configurable for Sputtering or PECVD applications
  • For use in R&D and batch production environments
  • Accepts up to 10" substrates
  • Vacuum chamber sizes up to 24"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                                   

Download Brochure

 
     
 
 Discovery Series   
 Discovery Series Sputtering System
  • Available with load lock substrate transport
  • For use in R&D and batch production environments
  • Accepts up to 12" substrates
  • Vacuum chamber sizes up to 30"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                    

Download Brochure

 
     
 
 Phoenix Series   
 Phoenix inline production system configurable for sputtering, PVD, PECVD applications
  • Inline production system configurable for Sputtering, PVD, or PECVD applications
  • Accepts up to 31" x 61" substrates
  • Chamber sizes up to 80"
  • Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software                                       

Download Brochure

 
     

Return to System Type and System Series.