Since 1964 Denton Vacuum, LLC has designed and manufactured cutting edge thin film deposition systems for R&D and manufacturing. Proprietary systems, developed to customer specifications, and standard thin film systems are available. Several standard turnkey batch systems are available to fit any budget from research and development to manufacturing. We also offer fully automated modular in-line systems tailored to meet the specific needs of high volume manufacturing processes. Modularity allows for low cost upgrades in technology and enables rapid ramp up as volume increases. Our deposition technologies include PVD, PECVD, Magnetron Sputtering, Electron Beam Deposition, Ion Beam Enhanced Deposition, Ion Assisted Deposition, Plasma Sterilization, Reactive / Thermal Deposition, Sputtering and Reactive Ion Etching. Our typical markets include Precision Optics, Opthalmics / Sunwear, Electronics, Electro-Optics, Telecommunications, Semiconductor Metallization, Thin Film R&D, Microscopy, Sample Preparation and Thermal Imaging. System Type and System Series: PECVD SYSTEMS Plasma-Enhanced Chemical Vapor Deposition (PECVD) is a process used to deposit thin films from a gas or liquid precursor to produce a specific thin film on a substrate. Precipitation of material is initiated by the creation of plasma and is generally RF frequency or DC discharge by electrodes. This electrically active coating area is filled with the reacting precursor. Applications for these processes include three dimensional or conformal coatings. Explorer Series | |  | - Configurable for Sputtering, PVD, or PECVD applications
- For use in R&D and batch production environments
- Accepts up to 10" substrates
- Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
- Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure |
| | Voyager Series | | | | | |  | - Configurable for Sputtering or PECVD applications
- For use in R&D and batch production environments
- Accepts up to 10" substrates
- Vacuum chamber sizes up to 24"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Helios Series | | | | | |  | - Batch production system for PECVD applications
- Accepts up to 39" substrates
- Chamber sizes up to 44"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Phoenix Series | | | | | |  | - Inline production system configurable for Sputtering, PVD, or PECVD applications
- Accepts up to 31" x 61" substrates
- Chamber sizes up to 80"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure |
Return to System Type and System Series. PVD SYSTEMS Physical Vapor Deposition (PVD) is a coating method that involves purely physical processes such as high temperature vacuum evaporation by electron beam , resistive or ion beam sputter bombardment rather than involving a chemical reaction. | | BTT IV | | | | | |  | - Configurable for Sputtering or PVD applications
- For use in R&D and sample preparation environments
- Accepts up to 6" substrates
- Bell jar size up to 12" dia. x 18" high
- Automated touch screen controls
|
Download Brochure | | | | | | | |
| | DV-502B | | | | | |  | - Rapidly cycles between atmosphere and high vacuum
- For use in R&D and sample preparation environments
- Accepts up to 6" substrates
- Bell jar size up to 12" dia. x 18" high
- Automated touch screen controls
|
Download Brochure | | | | | | | |
| | Discovery HDG | | | | | |  | - Ion Beam Etching & Reactive Ion Beam Etching
- Ion Beam Deposition & Ion Beam Assisted Deposition
- Accepts up to 8" substrates
- Vacuum chamber size 26" dia. x 30" wide
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Explorer Series | | | | | | | - Configurable for Sputtering, PVD, or PECVD applications
- For use in R&D and batch production environments
- Accepts up to 10" substrates
- Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
- Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Integrity Series | | | | | |  | - Batch production system for PVD applications
- Accepts up to 31" x 61" substrates
- Chamber sizes up to 80"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Phoenix Series | | | | | | | - Inline production system configurable for Sputtering, PVD, or PECVD applications
- Accepts up to 31" x 61" substrates
- Chamber sizes up to 80"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | |
Return to System Type and System Series. Ion Beam Etching | | | | | | The Discovery® HDG
Ion Beam Deposition and Etch Platform
The Discovery HDG provides a turnkey system for a range of processes: Ion Beam Deposition, Ion Beam Assisted Deposition, Ion Beam Etch, Reactive Ion Etch.
Features - Cool Substrate During Process
- Tilting to Off Axis Angles
- Rotation to 20 RPM
Discovery® HDG Brochure (Requires PDF reader) 
|  |
Powerful Control System available in semi-manual mode or in fully automatic mode with one push automation to reduce system downtime. Process Pro Upgrade Offers: - Consistent controls across all Denton Vacuum Products
- Standard software makes it easy to support and avoid costly customization fees
- Source code for your programs so you can customize your programs.
- Network capabilities makes the discovery a node on your network enabling real-time, remote support and upgrades.
Convenient Access to Subsystems
Rear or bottom mounted pumps provide easy access for service based on your workspace needs Multiple Pumping Configurations
A variety of cryogenic, mechanical and turbo pump configurations are available to fit your budget and process. | | Typical Appications - Nanotechnology
- Electronics
- Semiconductor (Compound or Other)
- Materials Research
- Research & Development
- Medical Devices
- Precision Milling
- Via Etching
|
| Options | Evaporation | HDG Tilt Fixture, Single Rotation, 6” or 8” Diameter | | HDG Tilt Fixture, Planetary Rotation, Three 6” Water Cooled Planets | | RF or DC Ion Beam Deposition Sources | | RF or DC Ion Beam Etch and Assist Sources | | Optical Spectroscopy and Point Detection | | | Pump Options | | | Turbo | | | Oil free mechanical | |
| | | | | |
Return to System Type and System Series. SPUTTERING SYSTEMS Sputtering deposition is a method of depositing thin films by using ions for ejecting material from a target which deposits a thin film onto a substrate commonly using RF, DC or Pulsed DC power sources. Applications for sputtering include scalpels, bone saws, reamers, or any flat substrate. | | Desk Series | | | | | |  | - Compact benchtop design
- For use in R&D and SEM applications
- Accepts up to 4" substrates
- Vacuum chamber 6" Pyrex or Steel (TSC model)
- Automated touch screen controls
|
Download Brochure | | | | | | | |
| | Desktop Pro | | | | | |  | - High performance Sputtering in a desktop design
- Configurable with up to two 2" magnatrons
- Accepts up to 6" substrates
- Vacuum chamber size 10" dia. x 10" high
- Automated touch screen controls
|
Download Brochure | | | | | | | |
| | BTT IV | | | | | | | - Configurable for Sputtering or PVD applications
- For use in R&D and sample preparation environments
- Accepts up to 6" substrates
- Bell jar size up to 12" dia. x 18" high
- Automated touch screen controls
|
Download Brochure | | | | | | | |
| | Explorer Series | | | | | | | - Configurable for Sputtering, PVD, or PECVD applications
- For use in R&D and batch production environments
- Accepts up to 10" substrates
- Vacuum chamber size 20" x 20" x 20" or Bell Jar up to 12" Dia. x 18" High
- Automated touch screen controls or computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Voyager Series | | | | | | | - Configurable for Sputtering or PECVD applications
- For use in R&D and batch production environments
- Accepts up to 10" substrates
- Vacuum chamber sizes up to 24"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Discovery Series | | | | | |  | - Available with load lock substrate transport
- For use in R&D and batch production environments
- Accepts up to 12" substrates
- Vacuum chamber sizes up to 30"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
| | Phoenix Series | | | | | | | - Inline production system configurable for Sputtering, PVD, or PECVD applications
- Accepts up to 31" x 61" substrates
- Chamber sizes up to 80"
- Computer controlled data aquisition, remote operation and diagnostics via Process Pro® software
|
Download Brochure | | | | | | | |
Return to System Type and System Series. |
